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cMat

發(fā)布時間： 2025-4-19關注次數(shù)：28

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cMat

Volume 2, Issue 1

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March 2025

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Air-Sintering of Dual-Ligand Capped Copper Nanoparticles for High-Temperature Interconnect Applications

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Yu-Ji Zheng^1,?, Jun-Jie Yuan^1,?, Qing-Hua Li¹, Zhe-Fei Sun¹, Heng-Hui Wang¹, Xiang Wu¹, Ti-Xun Li¹, Zi-Yu Zhou¹, Shi-Yu Xia¹, Jin-Tang Li¹, Hui-Jun Cao², Wen-Zhi Cai², Jonghwan Suhr^3,*, Zhi-Hao Zhang^1,3,*

廈門大學張志昊副教授，韓國成均館大學Jonghwan Suhr教授

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¹ Fujian Key Laboratory of Advanced Materials, Department of Materials Science and Engineering, College of Materials, Xiamen University, Xiamen, China

² School of Transportation Engineering, Xiamen City University, Xiamen, China

³ Department of Polymer Science and Engineering, School of Mechanical Engineering, Sungkyunkwan University, Suwon, South Korea

^? Yu-Ji Zheng and Jun-Jie Yuan have contributed to this work equally and should be regarded as co‐first authors.

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